Engine room ECU (direct mounting to the engine).Lineup of multi-layer circuit board materials with excellent high heat resistance and high reliability High heat resistance multi-layer materials Networking equipment (servers, routers), Measuring instruments, Automotive components, etc.High heat resistance (High-Tg) multi-layer circuit board materials Networking equipment(servers, routers), Measuring instruments, Automotive components, etc.Networking equipment (servers, routers), etc.Networking equipment(servers, routers), Measuring instruments, Antenna(Base station, Automotive millimeter-wave radar), etc.Networking equipment, Mainframe, IC tester, High frequency measuring device, Antenna(Base station, Automotive millimeter-wave radar), etc.ICT infrastructure equipment, High speed networking(High-end server/ router, Optical network, switch), High layer count PCB, etc.Halogen-free Ultra-low transmission loss Multi-layer circuit board materials High-end servers, High-end routers, Supercomputers, and other ICT infrastructure equipment, Antenna(Base station, Automotive millimeter-wave radar), etc.High speed & ultra-low transmission loss.Ultra-low transmission loss multi-layer circuit board materials Multi-layer circuit board materials suitable to large capacity and high speed transmission of high frequency signal Low transmission loss multi-layer materials Low CTE IC substrate materials Designed to Improve Reliability Low stress materials for thinner IC substrate Good MTH Processability(Mechanical Through Hole).High modulus Low CTE IC substrate materials IC PKG for base station application, Module part, etc.Ultra-low transmission loss Circuit board materials for IC substrate/Module Narrow pitch corresponding circuit board materialsĬontribute to IC substrates as thinner and smaller and low warpage
Power amplifier board(Base station for wireless communication, Small cell), Antenna(Base station), etc.High thermal conductivity Low transmission loss Halogen-free Multi-layer circuit board materials Antenna(Automotive millimeter-wave radar, Base station), etc.Halogen-free Ultra-low transmission loss Multi-layer Circuit board materials (which includes substrates, encapsulants and underfills) and electronic assembly materials.Īdditionally, the IC substrate materials' brand is transitioning from MEGTRON GX to LEXCM GX. The LEXCM brand now comprises all of the Semiconductor Device Materials IC packaging materials Panasonic Electronic Materials Division launches a new product brand for the Semiconductor Device Materials business.